PHONEFIX 18pcs phone BGA reballing stencil tool kit 0.3/ 0.35/ 0.5/ 0.55/ 0.6/ 0.76mm, universal BGA reballing rework net directly heating template for phone motherboard repair tool, GA reballing stencil template 0.3-0.76mm for cell phone / laptop repair soldering accessories.

18pcs BGA Reballing Stencil Template Universal Directly Heat: 0.3/ 0.35/ 0.5/ 0.55/ 0.6/ 0.76mm

These stencils were made by high quality steel , can be heated directly by the hot air gun, it is easy and quickly for reballing the BGA IC.

Features :

1. 18 stencils are in different sizes, suitable for chips in different sizes.
2. Can be directly heated.
3. Useful and economical accessories for BGA soldering.
4. Durable in use.

Suitable for solder balls: 0.25mm, 0.3mm, 0.35mm, 0.5mm, 0.55mm, 0.6mm, 0.76mm, 1.00mm.....

Package List :

• 18pcs x BGA reballing stencil tool